BATAM, Indonesia--(BUSINESS WIRE)--Unisem, a global provider of semiconductor assembly and test services, today announced its QFN side wall plating capability and LFGA package offering at the ...
Nickel plating on IC interconnect components serves as a protective layer that enhances the durability and performance of these components. It provides a smooth, dull grey appearance, although bright ...
Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
MacDermid Alpha Electronics Solutions Launches MICROFAB SC-40 PLUS to meet the latest advancements in semiconductor manufacturing. MICROFAB SC-40 PLUS represents a leap forward in semiconductor ...
Silver plating in IC interconnect components involves overlaying a thin layer of silver onto metal components. This process enhances the electrical conductivity of the components and facilitates ...
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